High resolution thermal imaging camera for electronic components

Seek Thermal InspectionCAM is a low-cost, high-resolution thermal imaging solution that enables fast and detailed analysis of electronic components. The data and heat signature provided by the thermal image can reveal undesirable operating states such as excessive thermal stress, damaged boards and components, and other potential failure points not visible to the naked eye. Seek InspectionCAM eliminates the difficulty and time-consuming identification of these failures using other test and measurement equipment.

See the electrical flow and layout of the entire wafer in seconds

Seek InspectionCAM is ideal for scientific research, testing and quality control, connection monitoring, and finding problems in circuit boards and integrated circuits. The Seek Thermal InspectionCAM enables the use of temperature data and thermal images to ensure electronics perform as designed. Evaluate the performance in great detail thanks to the large lens and small minimum focus range that InspectionCAM offers for perfect details up close.

Technical data

• Detector size: 320 x 240 sensor
• Thermal sensitivity: 65 mK (NETD)
• Maximum temperature: 300 °C (572 °F)
• Minimum temperature: 10 °C (50 °F)
• Image refresh rate: 9 Hz
• Field of view: 24 x 18 degrees
• IR / Fusion Overlay: No
• Video Out: Yes
• Focus: Manually adjustable
• Laser point: No
• Picture in picture: No
• Video recording: No
• Floating points: No
• Minimum focus distance: 40 mm (0.04 m)
• Accuracy: ± 5 °C or 5% between 0 °C and 300 °C for a scene temperature of 25 °C
• Backlight: No
• Digital zoom: No
• Voice annotation: No
• Intrinsically safe: No

Composition of the kit

• Seek Thermal InspectionCAM
• User guide (multilingual).