Name: Athlon X4 860K
Brand: AMD
SKU: 3230396
Price: 67 EUR
Availability: InStock
Rating: 4.67 (3 reviews)

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The AMD Athlon X4 860K is a powerful processor designed for desktop applications. With a clock speed of 3.7 GHz and the ability to reach up to 4.0 GHz in Turbo mode, this processor delivers impressive performance for various applications. The architecture is based on 28nm technology, allowing for efficient energy use. The Athlon X4 860K features four processor cores and supports up to four threads, making it ideal for multitasking and compute-intensive tasks. The processor is compatible with the FM2+ socket and supports DDR3-SDRAM with clock speeds of up to 2133 MHz. With a 4 MB L3 cache and a 2 MB L2 cache, it ensures fast data processing and efficient performance.

- Maximum Turbo clock speed of 4.0 GHz for additional performance
- Supports AMD Virtualization for enhanced virtualization capabilities
- Maximum Thermal Design Power (TDP) of 95 watts for efficient energy consumption
- PCI Express Version 3 for high data transfer rates
- Integrated technologies such as AMD Cool'n'Quiet to reduce power consumption.

Actual product image AMD Athlon X4 860K (FM2+, 3.70 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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