Name: EPYC 9554P - 3.1 GHz - 64 cores - 12
Brand: AMD
SKU: 32425507
Price: 2970.96 EUR
Availability: InStock

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The AMD EPYC 9554P is a powerful processor specifically designed for server applications. With a base clock frequency of 3.1 GHz and the ability to reach up to 3.75 GHz in Turbo mode, this processor delivers impressive performance for compute-intensive tasks. It features 64 cores and supports 128 threads, enabling efficient processing of multiple tasks simultaneously. The EPYC 9554P is equipped with a generous 256 MB L3 cache, further optimizing data processing speed. The processor uses the SP5 socket and supports the latest DDR5 memory with a maximum clock rate of 4800 MHz, making it a future-proof choice for modern server architectures. With a maximum Thermal Design Power (TDP) of 360 watts, the EPYC 9554P is designed for use in high-performance server environments, providing an excellent balance between energy efficiency and computing power.

- 64 cores and 128 threads for parallel processing
- 256 MB L3 cache to enhance data processing speed
- Supports DDR5 SDRAM with clock rates up to 4800 MHz
- Dodeca-channel memory architecture for high bandwidth
- Maximum TDP of 360 watts for high-performance server applications.

Actual product image AMD EPYC 9554P - 3.1 GHz - 64 cores - 12 (SP5, 3.10 GHz, 64 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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