Name: Xeon W W-2265
Brand: Intel
SKU: 21166080
Price: 1307.77 EUR
Availability: InStock

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Intel

The Intel Xeon W W-2265 is a powerful processor designed for demanding applications and workloads. With a base clock frequency of 3.5 GHz and the ability to reach up to 4.8 GHz in Turbo mode, this processor delivers impressive performance for multithreading applications. It features 12 cores and supports 24 threads, making it ideal for professional applications in data processing, graphic design, and scientific calculations. The processor is equipped with 19.25 MB of cache memory, further enhancing data processing speed. The Xeon W W-2265 also includes a variety of Intel technologies that improve processing efficiency and security. With a manufacturing process of 14 nm and a maximum Thermal Design Power (TDP) of 165 watts, this processor is both powerful and energy-efficient. It supports DDR4 RAM and offers a maximum memory capacity of up to 1 terabyte, making it an excellent choice for modern server and workstation applications.

- Maximum Turbo clock frequency of 4.8 GHz for additional performance
- Support for up to 1 TB DDR4 RAM
- Hyper-Threading technology for improved multitasking capabilities
- Intel Turbo Boost Max Technology 3.0 for optimized performance
- Quad-channel memory architecture for higher bandwidth.

Actual product image Intel Xeon W W-2265 (LGA 2066, 3.50 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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