3M 5413 High-temperature polyimide adhesive tape

and for other low and high temperature applications between -73 °C and 260 °C. The 3M™ High Temperature Polyimide Tape 5413 is designed for masking printed circuit boards during the soldering process and for other low and high temperature applications, between -73 °C to 260 °C. This brown, 68.58 µm thick adhesive tape consists of a polyimide film with silicone adhesive. In addition, the roll core is made of polyethylene instead of cardboard. The high temperature resistance of the silicone adhesive reduces adhesive leakage, eliminating the need for cleaning and thus increasing productivity, and the polyimide adhesive tape is easy to remove from the surface as it does not soften at higher temperatures and retains its shape. This means that no post-processing is required.